High Frequency Test Socket

Unique, patented spring probe system
- Suitable for ICs from 0.2 mm Pitch
- 5 standard base sizes up to 55mm².
- Customer specific for EVERY IC possible.
- Elastomer contact systems for up to 60GHz

Packages: CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and all other SMT-Packages.

 
Manufacturer ARIES
:
https://www.dema.net/en/manufacturer/aries-test-burn-in