Thermal Management Overview - 3M

3M Thermally Conductive Adhesive Transfer Tapes

This range of high adhesion thin tapes offers you efficient thermal transfer for a wide range of applications requiring a thermal solution: bonding heat sinks, heat spreaders and other cooling devices to IC packages, power transistors, and other heat generating components. Each tape combines 3M high performance acrylic adhesive with highly conductive ceramic particles for an extremely reliable and user-friendly thermal interface. Highly conformable construction provides excellent wet-out on surfaces. Select 5, 10, 15 and 20 mil thicknesses to meet application requirements. The unique 40 mil 9889FR is a highly conformable pressure-sensitive film that offers a combination of high thermal conductivity, good dielectric properties, high bond strength, and ease of use.

Thermally Conductive Tapes Series 8805, 8810, 8815, 8820 for applications requiring thin bonding with good thermal transfer. Applications include CPU, flex circuit, and power transformer bonding to heat sinks or other cooling devices. The highest mechanical strength thermally conductive tapes feature excellent adhesion properties, improved surface wetout, and excellent shock performance. Available in 5, 10, 15 and 20 mil thicknesses. UL 746C Listing. Component Electrical Equipment: (File MH17478, Category QOQW2), High temperature adhesion and Dielectric strength.

Thermally Conductive Tapes Series: 9882, 9885, 9890, 9889FR combine the highest performance acrylic adhesive with highly conductive ceramic particles to provide an extremely reliable and user-friendly thermal interface material. Tapes are available in 2, 5, 10 and 40 mil thicknesses. UL 746C Listing. Component Electrical Equipment: (File MH17478, Category QOQW2), High Temperature Adhesion and Dielectric Strength.

Übersicht zum Download: 3M Thermal Management (PDF Datei)

3M Thermally Conductive Interface Pads

Through innovative 3M technology, these soft and conformable pads provide high levels of conductivity for the more demanding
applications in the electronics industry. In addition, the pads provide excellent handling and can be die cut to fit most applications. Available in silicone and non-silicone elastomers.

Thermally Conductive Interface Pads for applications requiring gap filling, superior thermal performance without bonding. Provides IC package and PCB thermal interfacing with heat sinks or other cooling devices, and metal cases.

Soft, conformable pads provide high levels of conductivity for the most demanding electronics applications Provide excellent handling and can be die-cut to fit most applications - Silicon and non-silicon elastomers Non siloxane out gassing benefits with Acrylic products - 5590H for roll supplied easy die cut converting.

Übersicht zum Download: 3M Thermal Management (PDF Datei)

3M Thermally Conductive Epoxies

This range of liquid adhesives has minimal odor and superior structural strength adhesion. Dispensing is easy for high output in-line automated manufacturing and manual application. Adhesive flows and fills micro-spaces on surfaces. Ultra-thin bond line helps achieve low thermal impedance.

Thermally Conductive Epoxies for applications requiring high adhesive strength, good surface wet out, gap filling, and good thermal transfer. Provides IC package and PCB thermal interfacing with heat sinks or other cooling devices.

Range of liquid adhesives with minimal odour and superior structural strength adhesion Easy dispensing for high output, in-line automated manufacturing and manual applications. Adhesive flows and fills micro-spaces on surfaces - Ultra-thin bond line helps achieve low thermal impedance.

Übersicht zum Download: 3M Thermal Management (PDF Datei)