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| |  | PRODUCT DESCRIPTION |  |  |  | |  | The SMD system has been specially design for use with printed circuit boards in a sandwich form and for the connection of PCB's in different layers. It offers the end-user more freedom in designing the electronic: |  |  |  | High flexibility |  |  | Ability to withstand high temperatures, can be reflow-soldered |  |  |  | Best solution for 90 deg or 180 deg PCB SMD interconnection |  |  | Blister packing on reel for fully automatic insertion |  |  | Available pitch 0.036 " with insulation length of 0.44 " and 0.59 ". Number of pols 6 to 22. |  |  | SMD solutions can be manufactured to meet any customer requirement. |  | |  |  |  |  |  | |  | Ordering Code |  |  |  | |  |   |  | |  |  |  |  |  | |  | TECHNICAL DATA |  |  |  | |  | | Pitch | in | 0,0366 | | Number of positions max. |  | 6 to 22 | | Insulation material |  | Polyimid-Foil mil 0,98 + glue) | | Insulation resistance | Ω | 108 | | Co-planarity tolerance | in | 0.0059 | | Bending radius min. | in | 0.0787 | | Bending cycles max. |  | 20 x 135° | | Conductor material |  | Cu mil 5,91 | | Current rating at 68°F | A | 1 | | Soldering temperature | °F/sec. | 500/10 reflowable | | Operating temperature | °F | -40...+257 |
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