RF Test Sockets w/Replaceable Contact Strips
These sockets use our patented Microstrip™ contacts which lie flat on the DUT board and become part of the transmission line. Self-inductance as low as 0.01nH and Frequency Response to 19GHz.

Thermoelectric-cooled RF Test Socket
Peltier Technology is incorporated into test socket lid assembly. The thermoelectric cooler (TEC) provides fast and accurate temperature control, while the built-in epoxy-encapsulated thermistor maintains a highly-accurate temperature sensing of ±0.02°C.

High-Frequency Interposer Socket
Now you can get the best of both worlds! The Kapton Interposer socket gives you the High-frequency characteristics of our Microstrip™ Contact Socket combined with the close component placement of our Spring Probe Sockets. Signal paths can be as short as 0.008" [0.203mm] while the pad layouts can be identical to the package footprint.

High-Frequency Center Probe™ Test Socket for Devices up to 13mm Square
For test & dynamic burn-in of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices on any pitch of 0.40mm pitch or higher. This socket is easily mounted and removed to & from the PCB due to solderless pressure-mount compression spring probes.

High-Frequency Center Probe™ Test Socket for Devices from 14 to 27mm Square
Our answer for a reliable Area Array Package socket. Our unique style of probes will work for any application. Available pitches down to 0.5mm with Frequency Response over 10GHz!

Machined High-Frequency Center Probe Test Socket for BGA, CSP & MLF Packages
Our answer for a reliable Area Array Package socket. Our unique style of probes will work for any application. Available pitches down to 0.5mm with Frequency Response over 10GHz!

High-Frequency Center Probe™ Test Socket for Devices up to 40mm Square
For high-frequency Testing & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices on any pitch device on 0.40mm or larger. The 4-point Crown insures “scrub” on solder oxides.

High-Frequency Center Probe™ Test Socket for Devices up to 55mm Square
For high-frequency testing of CSP, BGA, DSP, LGA, SRAM, DRAM, and Flash devices on any pitch of 0.50mm or larger. The four-point crown insures “scrubbing” of solder oxides, while pointed probe works with LGA’s, MLF’s, etc.