Your Best Source for Interconnection & Packaging Solutions!

Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™
technology with of variety of interconnect products for Test and Burn-in applications including...

• ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC Devices
• Correct-A-Chip™ Product Line of “Intelligent Connectors” – incorporating Passive and Active Components
• Adapters – Connectors Using One Termination Style on Boards Designed for Different Styles
• BGA (Ball Grid Array) and LGA (Land Grid Array) Sockets
• High-Frequency (RF) Test and Burn-in Sockets

• Installation of Pins into Plastic
• Molding Engineered Plastics with Tight Tolerances
• Crimping Connectors on Flat Cable
• Flat Cable Wire Stripping and Separation
• Custom High-Frequency (RF) Socket Design (-1dB Bandwidth at 10GHz)
• Surface-mounting of Electronic Components
• Bending Pins (Vertisocket™ Line)
• Patented Limited-Depth Pin Assembly
• Assembly of Solder Balls on Ceramic PC Boards and Connectors

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Test and Burn-In Products from Aries: