• For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices
• Any pitch device on 0.30mm or larger
• 4-point crown insures “scrub” on solder oxides
• Single Point Probes available for small land area contact pads
• Signal path during test only 0.077 [1.96]
• Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which are accurately located by 2 molded plastic alignment pins and mounted with 4 stainless steel screws
• The gold over nickel plated compression spring probes leave very small witness marks on the bottom surface of the device solder balls
• Standard molded socket format can accommodate any device package of 40mm or smaller
• Pressure pad compression spring provides proper force against device and allows for height variations in device thickness

SPECIFICATIONS

• Molded Socket Components: UL94V-0 PEEK and/or Ultem
• 1dB Bandwidth: 1GHz (0.80mm pitch) (large probe)
• Estimated Contact Life: 500,000 cycles
• Compression Spring Probes: heat-treated Beryllium-Copper with 30µ min. [0.75µ] Gold per Mil-G-45204 over 30µ min. [0.75µ] Nickel per SAE-AMS-QQ-N-290
• Contact Force :
  15g per contact on 0.30-0.35mm pitch
  16g per contact on 0.40-0.45mm pitch
  25g per contact on 0.50-0.75mm pitch
  25g per contact on 0.80mm pitch or larger
• Operating Temperature: -55°C (min.) to 150°C (max.) [-67°F to 302°F]
• All Hardware: Stainless Steel
• Typical Burn-in Temperature: 150°C maximum

MOUNTING CONSIDERATIONS

• See “PCB FOOTPRINT TOP VIEW” for requirements
• Sockets must be handled with care when mounting or removing sockets to/from PCB
• Test PCB Diameter “P” :
  0.025 [0.64] (large probe 0.80mm pitch and larger)
  0.015 [0.38] (small probe 0.50-0.75mm pitch)
  0.012 [0.31] (small probe 0.40-0.45mm pitch)
  0.009 [0.23] (small probe 0.30-0.35mm pitch)