| Hi-Temp 200°C Test & Burn-in Sockets for BGA, LGA, QFN, MLCC and Bumped Die Devices von Aries | | Enables Testing of Any Area-array Device to +200°C High-temp Sockets useful in Military, Aerospace and Geophysical Applications Aries Electronics, a US manufacturer of standard, programmed and custom interconnection products used worldwide, now offers the industry's first CSP sockets that accept any area-array device for high-temperature testing up to +200°C. The new AR4HT Series sockets incorporate a low-profile 0.45 mm contact structure (compressed) that is shorter than other low-profile contacts and provides excellent compliance for reliable ATE testing and burn-in.
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■ Hi-Temp 200°C Test & Burn-in Sockets  39 KB
Weiterführende Informationen finden Sie auf: http://www.dema.net/aries/
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