Aries’ Machined High-Frequency Center Probe Test Sockets Now Available in Pitch Sizes Down to 0.30 mm
Ideal for wide variety of BGA, CSP and MLF packages
Aries Electronics, manufacturer of standard, programmed and custom interconnection products, now offers machined high-frequency center probe test sockets to accommodate IC devices with a lead pitch of 0.30 mm. With very low inductance and capacitance, the sockets are ideal for a wide variety of BGA (ball grid array), CSP (chip scale package) and MLF (micro land frame) packages.
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