| Aries’ Machined High-Frequency Center Probe Test Sockets Now Available in Pitch Sizes Down to 0.30 mm | Ideal for wide variety of BGA, CSP and MLF packages
Aries Electronics, manufacturer of standard, programmed and custom interconnection products, now offers machined high-frequency center probe test sockets to accommodate IC devices with a lead pitch of 0.30 mm. With very low inductance and capacitance, the sockets are ideal for a wide variety of BGA (ball grid array), CSP (chip scale package) and MLF (micro land frame) packages.
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■ Machined High Frequency Center Probe Test Sockets  16 KB
Weiterführende Informationen finden Sie auf:
DEMA Part ID: 24010 – Datasheet Link: http://www.dema.net/pdf/htm/9595
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