| Hi-Temp 200°C Test & Burn-in Sockets for BGA, LGA, QFN, MLCC and Bumped Die Devices von Aries | | Enables Testing of Any Area-array Device to +200°C High-temp Sockets useful in Military, Aerospace and Geophysical Applications Aries Electronics, a US manufacturer of standard, programmed and custom interconnection products used worldwide, now offers the industry's first CSP sockets that accept any area-array device for high-temperature testing up to +200°C. The new AR4HT Series sockets incorporate a low-profile 0.45 mm contact structure (compressed) that is shorter than other low-profile contacts and provides excellent compliance for reliable ATE testing and burn-in.
Lesen Sie das komplette PRESS RELEASE:
■ Hi-Temp 200°C Test & Burn-in Sockets  39 KB
Weiterführende Informationen finden Sie auf: http://www.dema.net/aries/
| |
|
|
| Aries’ Machined High-Frequency Center Probe Test Sockets Now Available in Pitch Sizes Down to 0.30 mm | Ideal for wide variety of BGA, CSP and MLF packages
Aries Electronics, manufacturer of standard, programmed and custom interconnection products, now offers machined high-frequency center probe test sockets to accommodate IC devices with a lead pitch of 0.30 mm. With very low inductance and capacitance, the sockets are ideal for a wide variety of BGA (ball grid array), CSP (chip scale package) and MLF (micro land frame) packages.
Lesen Sie das komplette PRESS RELEASE:
■ Machined High Frequency Center Probe Test Sockets 16 KB
Weiterführende Informationen finden Sie auf:
DEMA Part ID: 24010 – Datasheet Link: http://www.dema.net/pdf/htm/9595
| |
|
|
