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22 | 02 | 2012
 
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DEMA Electronic AG
Aries Electronics - Test and Burn-In

Your Best Source for Interconnection & Packaging Solutions!

Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™
technology with of variety of interconnect products for Test and Burn-in applications including...

  • ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC Devices
  • Correct-A-Chip™ Product Line of “Intelligent Connectors” – for Passive and Active Components
  • Adapters – Connectors Using One Termination Style on Boards Designed for Different Styles
  • BGA (Ball Grid Array) and LGA (Land Grid Array) Sockets
  • High-Frequency (RF) Test and Burn-in Sockets


Test and Burn-In Products from Aries:

Link to

- Aries Electronics

Product News

- New Kelvin Test Socket
- New Fine Pitch Bump Adapters
- Socket 23017 Adjustable Preasure Pad
- Switch a Pitch Adapter

PDF Download

- Product Selection Webguide
- Test and Burn-In Overview
- CSP Test Socket Explanation
- FAQ: BGA and CSP Socket Explanation
1 Correct-A-Chip™ Adapters - ARIES
2 BGA, µBGA, LGA, QFN, QFP, MLF, LCC & CSP Sockets and Adapters - ARIES
3 Zero-Insertion-Force (ZIF) Test Sockets - ARIES
4 High-Frequency (RF) Test Sockets - ARIES
5 LED / LCD Display Sockets - ARIES
6 DIP / SIP Sockets and Headers - ARIES
7 PGA & other Sockets - ARIES
8 Programming Devices - ARIES
9 Tools & Accessories - ARIES

Aries Product News Flash
Hi-Temp 200 °C Test and Burn-in Socket
Hi-Temp 200°C Test & Burn-in Sockets for BGA, LGA, QFN, MLCC and Bumped Die Devices von Aries
Enables Testing of Any Area-array Device to +200°C High-temp Sockets useful in Military, Aerospace and Geophysical Applications

Aries Electronics, a US manufacturer of standard, programmed and custom interconnection products used worldwide, now offers the industry's first CSP sockets that accept any area-array device for high-temperature testing up to +200°C. The new AR4HT Series sockets incorporate a low-profile 0.45 mm contact structure (compressed) that is shorter than other low-profile contacts and provides excellent compliance for reliable ATE testing and burn-in.

Lesen Sie das komplette PRESS RELEASE:
Hi-Temp 200°C Test & Burn-in Sockets 39 KB

Weiterführende Informationen finden Sie auf: http://www.dema.net/aries/

 
ARIES Machines High Frequency Center Probe Test Socket
Aries’ Machined High-Frequency Center Probe Test Sockets Now Available in Pitch Sizes Down to 0.30 mm

Ideal for wide variety of BGA, CSP and MLF packages

Aries Electronics, manufacturer of standard, programmed and custom interconnection products, now offers machined high-frequency center probe test sockets to accommodate IC devices with a lead pitch of 0.30 mm. With very low inductance and capacitance, the sockets are ideal for a wide variety of BGA (ball grid array), CSP (chip scale package) and MLF (micro land frame) packages.

Lesen Sie das komplette PRESS RELEASE:
Machined High Frequency Center Probe Test Sockets 16 KB

Weiterführende Informationen finden Sie auf:
DEMA Part ID: 24010 – Datasheet Link: http://www.dema.net/pdf/htm/9595

 
DEMA Electronic AG