Your Best Source for Interconnection & Packaging Solutions!

Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™
technology with of variety of interconnect products for Test and Burn-in applications including...

ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC Devices
Correct-A-Chip™ Product Line of “Intelligent Connectors” – for Passive and Active Components
Adapters – Connectors Using One Termination Style on Boards Designed for Different Styles
BGA (Ball Grid Array) and LGA (Land Grid Array) Sockets
High-Frequency (RF) Test and Burn-in Sockets

Test and Burn-In Products from Aries:

Link to

- Aries Electronics

Product News

- New Kelvin Test Socket
- New Fine Pitch Bump Adapters
- Socket 23017 Adjustable Preasure Pad
- Switch a Pitch Adapter

PDF Download

- Product Selection Webguide
- Test and Burn-In Overview
- CSP Test Socket Explanation
- FAQ: BGA and CSP Socket Explanation