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Product News Flash
Machined High-Frequency Center Probe Test Sockets Now Available in Pitch Sizes Down to 0.30 mm - ARIES
Ideal for wide variety of BGA, CSP and MLF packages
Aries Electronics, manufacturer of standard, programmed and custom interconnection products, now offers machined high-frequency center probe test sockets to accommodate IC devices with a lead pitch of 0.30 mm. With very low inductance and capacitance, the sockets are ideal for a wide variety of BGA (ball grid array), CSP (chip scale package) and MLF (micro land frame) packages.
100kb, 1MBd und 10MBd High Speed Photocoupler - LITEON
The NEW LTV0501, LTV0601 and LTV0701 Series is ideally suited to be used in motor control, pulse transformers, digital and high logic ground isolation and al lot more industrial applications.
