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Product News Flash
Machined High-Frequency Center Probe Test Sockets Now Available in Pitch Sizes Down to 0.30 mm - ARIES
Ideal for wide variety of BGA, CSP and MLF packages
Aries Electronics, manufacturer of standard, programmed and custom interconnection products, now offers machined high-frequency center probe test sockets to accommodate IC devices with a lead pitch of 0.30 mm. With very low inductance and capacitance, the sockets are ideal for a wide variety of BGA (ball grid array), CSP (chip scale package) and MLF (micro land frame) packages.